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TiN涂覆的Ti-6Al-4V注入Cu2+后的抑菌性与细胞相容性研究
引用本文:褚珊珊,万荣欣,吕晓飞,顾汉卿,彭诚.TiN涂覆的Ti-6Al-4V注入Cu2+后的抑菌性与细胞相容性研究[J].中国生物医学工程学报,2019,38(2):208-215.
作者姓名:褚珊珊  万荣欣  吕晓飞  顾汉卿  彭诚
作者单位:1.(天津医科大学第二医院,天津 300211)2.(天津医科大学天津市泌尿外科研究所,天津 300211)
基金项目:国家重点研发计划课题(2016YFC1100300);国家高技术研究发展计划(863计划)(2015AA034702);天津市应用基础与前沿技术研究计划(重点项目)(15JCZDJC3820)
摘    要:在TiN 涂覆的 Ti-6Al-4V表面分别注入一定剂量的Cu2+或Ag+,研究并对比所注入表面的抑菌性和细胞相容性。将L929细胞分别接种于4种材料上:空白对照组——Ti-6Al-4V(钛合金组),阴性对照组——TiN涂覆的Ti-6Al-4V(TiN组),阳性对照组——TiN涂覆的Ti-6Al-4V表面注Ag(注Ag组),实验组——TiN涂覆的Ti-6Al-4V表面注Cu(注Cu组)。通过激光共聚焦观察细胞的骨架形态,通过扫描电镜观察细胞铺展黏附,通过CCK-8检测细胞增殖。将金黄色葡萄球菌液滴到各组样品表面,24 h后通过活菌铺板计数法观察材料表面活菌的菌落数目,用激光共聚焦、扫描电镜观察细菌黏附、形态。接触角检测材料亲水性,XPS检测材料表面元素组成,ICP-MS检测材料目标元素离子析出量。激光共聚焦和扫描电镜:注Ag组和注Cu组细胞较为密集,黏附、铺展充分,可见板状伪足与丝状伪足。CCK-8:接种1、3、5天后,注Ag组和注Cu组细胞与钛合金组以及TiN组相比增殖明显,证明这两组材料没有明显毒性。活菌铺板计数:注Cu组和注Ag组菌落少,抑菌率分别为91%±2%和87%±2%。激光共聚焦和扫描电镜:注Cu组和注Ag组的细菌比钛合金组和TiN组的金黄色葡萄球菌黏附少。细胞壁完整性被破坏,部分细菌破碎。研究表明,TiN涂覆Ti-6Al-4V表面注Cu和注Ag均具有较好的细胞相容性和抑菌性。

关 键 词:TiN涂覆  Ti-6AI-4V  MEVVA离子注入  Cu抑菌性  细胞相容性  
收稿时间:2018-09-05

Study on the Antibacterial Activity and Biocompatibility of TiN Coated Ti-6Al-4V Implanted with Cu2+
Chu Shanshan,Wan Rongxin,Lv Xiaofei,Gu Hanqing,Peng Cheng.Study on the Antibacterial Activity and Biocompatibility of TiN Coated Ti-6Al-4V Implanted with Cu2+[J].Chinese Journal of Biomedical Engineering,2019,38(2):208-215.
Authors:Chu Shanshan  Wan Rongxin  Lv Xiaofei  Gu Hanqing  Peng Cheng
Institution:1.(The Second Hospital of Tianjin Medical University, Tianjin 300211, China)2.(Tianjin Institute of Urological Surgery, Tianjin Medical University, Tianjin 300211, China)
Abstract:The aim of this work is to investigate and compare the antibacterial activity and biocompatibility of Ti-6Al-4V carrying TiN implanted with Cu2+ and Ag+ respectively. L929 cells were incubated on blank control group - Ti-6Al-4V (titanium alloy group), negative control group -TiN coated Ti-6Al-4V (TiN group), positive control group -TiN coated Ti-6Al-4V surface conjugated with Ag (Ag group), experimental group - TiN coated Ti-6Al-4V surface conjugated with Cu (Cu group). The cytoskeleton morphology of the cells was observed by laser confocal scanning. Scanning electron microscope was used to observe the spreading, adhesion and growth of cells on the substrates. Cell proliferation was measured by CCK-8 assay. The straphylococcus aureus solution was dropwise added to the surface of each group of samples. After 24 h incubation, the number of viable bacteria colonies on the surface of the material was determined by the plate count method. The contact angle reflects the hydrophilzicity of the material. XPS reflects the surface elements composition of the material and ICP-MS can reflect the amount of ion precipitation of the target element of the material. CLSM and SEM: The cells in the Ag group and the Cu group were dense, meanwhile spread and adhered on the substrates, showing slab pseudopods and filopodia. CCK-8 result: After 1 day, 3 day, and 5 day incubation, viable cells in Ag group and Cu group were more than those on the titanium alloy group and the TiN group, which proved that the two groups had no apparent toxicity. Plate count method: The Ag group and Cu group had fewer colonies; the bacteriostasis rate was 91%±2% and 87%±2% respectively. CLSM and SEM: The bacteria adhered on Cu group and Ag group was less than those on titanium alloy group and TiN group. The integrity of bacterial wall was damaged and even broken. The Cu group and Ag group showed similar cell compatibility and antibacterial property.
Keywords:MEVVA ion implantation  Cu  antibacterial activity  biocompatibility  
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