氯已定预处理对两步法自酸蚀粘接剂牙本质粘接界面稳定性的影响

目的：探讨氯已定预处理对两步法自酸蚀粘接剂的牙本质粘接界面稳定性的影响.方法：40颗离体人磨牙沿垂直于牙长轴的方向切割,暴露冠中部牙本质作为粘接面,牙本质试件随机分为两组,一组在粘接处理前涂布0.2％氯已定为实验组,一组无预处理为对照组,两组经两步法自酸蚀粘接剂SE Bond处理后,堆积复合树脂制备成粘接试件.每组随机抽取2个试件借助微拉曼光谱仪分析粘接剂的双键转化率,剩余的18个试件随机分为两个亚组,分别于即刻和冷热循环5000次后检测微拉伸粘接强度和界面的纳米渗漏情况.结果：0.2％氯已定预处理对SE Bond的树脂双键转化率无显著性影响（P＞0.05）.即刻测试时,对照组和实验组间的微拉伸粘接强度和纳米渗漏差异无统计学意义（PP ＞0.05）.冷热循环老化处理后,实验组的微拉伸粘接强度显著高于对照组,纳米渗漏程度显著低于对照组（P＜0.05）.结论：0.2％氯已定预处理不会干扰SE Bond的树脂聚合,且可提高其与牙本质粘接界面的稳定性.

Effect of chlorhexidine pretreatment on the bonding stability of a two-step self-etching adhesive to dentin

Objective： To investigate the effect of chlorhexidine （CHX） on the bonding stability of a two-step self- etching adhesive to dentin. Method： Forty molars were sectioned perpendicularly to the axis of the teeth to expose the mid- dle-coronal dentin surfaces. The teeth were randomly divided into two groups according to the dentin treatment： One was pretreated with 0.2 % CHX prior to the SE primer application,the other was control group that without any pretreatment were. After the adhesive treatment with clearfil SE Bond, the core build-up was made on the dentin surfaces. Two specimens from each group were used to detect the degree of conversion （DC）with the micro-Raman spectroscopy. The remained eigh- teen specimens in each group were then divided into two subgroups and subjected to the Microtensile bond strength （μTBS） test and nanoleakage evaluation before and after thermal cycling respectively. Result： Pretreatment with 0.2 % CHX showed no effect on the DC of SE Bond. Without thermocycling treatments, no significant differences were detected in the of bond strength and nanoleakage values between the control group and the group with CHX pretreatment. After the thermocycling treatments,the group with CHX pretreatment presented the significantly higher μTBS and lower nanoleakage values than those of the control group （P 〈0.05）. Conclusion： pretreatment with 0.2 % CHX not affect the DC of SE Bond and could im- prove the bonding stability of the two-step self-etching adhesive SE Bond.