Graphene platelet reinforced copper composites for improved tribological and thermal properties |
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| Authors: | Mingxia Wu Zhe Chen Chunjie Huang Kunlan Huang Kyle Jiang Jian Liu |
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| Affiliation: | School of Mechanical Engineering, Sichuan University, Chengdu 610065 China.; Institute of Mechanics, Materials and Civil Engineering, Université Catholique de Louvain, 1348 Louvain-la-Neuve Belgium ; School of Mechanical Engineering, University of Birmingham, Birmingham B15 2TT UK |
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| Abstract: | In this work, investigations were conducted to evaluate a type of graphene platelet–reinforced copper (GPL/Cu) composite for enhanced tribological and thermal properties. The pin-on-disc (steel) results show that the wear loss and the friction coefficient of the composites decrease by nearly 80% and 70%, respectively, in comparison with those of pure Cu. Thermal conductivity of the composites initially improves substantially by approximately 30% with a slight loading of 0.25 vol% GPLs and decreases gradually with a higher content of GPLs. Microstructural analysis reveals that the enhancement in the tribological property is attributed to both the self-lubricating property of GPLs and grain refinement while the improvement in the thermal property is closely associated with the uniform dispersion of GPLs.The uniform dispersion and self-lubricating property of GPLs enhance both the tribological and thermal performances. |
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