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大鼠皮肤降钙素基因相关肽正常分布及烫伤后改变规律
引用本文:王波涛,陈璧,胡大海,汤朝武.大鼠皮肤降钙素基因相关肽正常分布及烫伤后改变规律[J].中华烧伤杂志,1999(1).
作者姓名:王波涛  陈璧  胡大海  汤朝武
作者单位:第四军医大学西京医院烧伤科,第四军医大学西京医院烧伤科,第四军医大学西京医院烧伤科,第四军医大学西京医院烧伤科
摘    要:目的探讨皮肤创面降钙素基因相关肽(CGRP)的来源。方法运用免疫组化技术检测烫伤后早期大鼠皮肤烫伤创面,创周及远处未损伤皮肤内含 CGRP 的神经分布密度改变。结果烫伤后15 min 在以上所有部位的含 CGRP 神经纤维分布密度明显下降。烫伤后6至12 h 达到最低值,而后逐渐恢复,相比之下,在创周恢复过程出现较早;此外,在创面和创周的真皮层 CGRP免疫反应阳性的巨噬细胞样大细胞从局部血管中游出,烫伤后12 h 该细胞与含 CGRP 神经关系密切,烫伤后24 h 该细胞染色增强,破碎并释放大量 CGRP 免疫反应阳性的颗粒状物质,而后这些细胞在局部消失。结论在皮肤创面针对烧伤损害 CGRP 可能不仅从皮肤神经末端释放,也能由局部炎性细胞合成释放。

关 键 词:降钙素基因相关肽(CGRP)  免疫组化  烧伤  神经肽

The origin of calcitonin gene-related peptide (CGRP) in burned skin of rats
WANG Botao CHEN Bi HU Dahai.The origin of calcitonin gene-related peptide (CGRP) in burned skin of rats[J].Chinese Journal of Burns,1999(1).
Authors:WANG Botao CHEN Bi HU Dahai
Institution:WANG Botao CHEN Bi HU Dahai Department of Burns,Xijing Hospital of Fourth Miliary Medical University,Xi'an,710032
Abstract:Objective To investigate the origin of calcitonin gene related-peptide(CGRP)in skin burn wound.Methods Immunohistochemistry technique was used to determine change in distributive density in CGRP-containing nerve fibers in the wound,wound margin,remote intact skin of rats during the first 96 hours postburn.Results It was shown that the distributive density of CGRP-containing nerve fibers in all areas decreased at 15 rain postburn,but the density recovered earlier in wound margins com- pared to other sites.In addition,CGRP immunoreactive positive cells,which emigrated from blood vessel in dermis underneath the wound and wound margin,were related to CGRP-containing nerve fibers at 12 hours.Stronger staining intensity to CGRP was observed in those cells and they disintegrated and released CGRP immunoreactive materials into the dermis at 24 hours.Thereafter,those cells disappeared.Conclu- sion CGRP not only is released from cutaneous nerve,but also is synthesized and released by immune cells in response to burns.
Keywords:Calcitonin gene related peptide (CGRP)  Immunohistochemistry  Burn  Neuropeptide
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