Thermally Cross‐Linkable Poly(p‐xylylene)s for Advanced Low‐Dielectric Applications

A novel series of poly(p‐xylylene) homopolymer and copolymers containing thermally cross‐linkable cyclohexenyl moiety are prepared via base‐catalyzed Gilch route to yield high‐molecular‐weight polymers. The resulting polymers are highly soluble in a wide range of organic solvents and could be solution cast into flexible and transparent films. The polymers are thermally stable up to 350 °C and the glass transition temperature (T_g) is in the range of 136 ? 250 °C. They undergo thermal cross‐linking via the cyclohexenyl moiety. The cross‐linked polymer exhibits a high T_g of 294 °C, a low coefficient of thermal expansion (CTE) of 45 ppm K^?1. A low dielectric constant of 2.5 and a very low dielectric loss tan δ of 0.0004 at 1 GHz are obtained, which are superior to conventional interconnect polymers.