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Ⅰ型胶原膜、胞外基质提取物膜体外构建人工真皮能力比较
引用本文:王新文,金岩,刘源,聂鑫,赵宇. Ⅰ型胶原膜、胞外基质提取物膜体外构建人工真皮能力比较[J]. 生物医学工程与临床, 2004, 8(2): 69-71
作者姓名:王新文  金岩  刘源  聂鑫  赵宇
作者单位:第四军医大学口腔医院病理学教研室,陕西,西安,710032
摘    要:比较Ⅰ型胶原与胞外基质(extracellularmatrix,EM)提取物冻干后形成的膜(EM膜)在体外构建人工真皮的能力,以选择一种更有利于人工真皮形成的支架材料。方法分别使用小牛真皮部分提取的Ⅰ型胶原蛋白和胞外基质提取物冻干后制备基质网架,植入皮肤成纤维细胞,形成人工真皮。用扫描电镜观察I型胶原膜和EM膜的表面形态结构;选取不同的时间点,对种植于两种支架材料上的细胞进行计数,并利用间接ELISA方法检测人工真皮复合物中的细胞Ⅰ型胶原分泌情况,通过统计学的分析手段,对细胞的生长情况做出判断;用组织学方法观察人工真皮的形成情况。结果扫描电镜观察结果,两种膜在外观形态上无明显差异;细胞在EM膜上的增殖速度较Ⅰ型胶原膜快;ELISA分析显示,EM-细胞复合物中的成纤维细胞能够分泌更多的Ⅰ型胶原;与Ⅰ型胶原膜相比,EM在培养液中的降解更为缓慢,种植后的成纤维细胞在EM膜上生长旺盛,细胞层次明显多于前者,形成了较为明显的真皮样组织。结论EM膜适于成纤维细胞的生长,体外降解速率慢,是一种较Ⅰ型胶原膜更为理想的真皮支架材料。

关 键 词:胶原  胞外基质  人工真皮  组织工程
文章编号:1009-7090(2004)02-0069-03
修稿时间:2003-12-13

Comparison Study on the Ability of Forming Artificial Dermis Between Type Ⅰ and EM Collagen Membranes
WANG Xin-wen,JIN Yan,LIU Yuan,NIE Xin,ZHAO Yu. Comparison Study on the Ability of Forming Artificial Dermis Between Type Ⅰ and EM Collagen Membranes[J]. Biomedical Engineering and Clinical Medicine, 2004, 8(2): 69-71
Authors:WANG Xin-wen  JIN Yan  LIU Yuan  NIE Xin  ZHAO Yu
Abstract:Objective To compare the ability of forming artificial dermis between type I and extracellular matrix(EM) membranes, and select a more beneficial frame material for the construction of artificial dermis. Methods Type I collagen and primary collagen were extracted from new-born bovine skin,and then frozen into membranes. The membranes surface was observed by SEM. Skin fibroblasts were implanted on the membranes to form the artificial dermis and then observed after HE staining. Proliferation ability of the cells were observed by culturing cells and the function of fibroblasts was analyzed by ELISA method. Results The EM membrane degraded slower than the type I collagen. The fibroblasts implanted on the EM membrane grew quickly and were able to produce more type I collagen. Conclusion The EM membrane is better than pure type I collagen in constructing the artificial dermis.
Keywords:collagen  extracellular matrix  artificial dermis  tissue engineering
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