Effect of Post-Process Curing and Washing Time on Mechanical Properties of mSLA Printouts |
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Authors: | Bartł omiej Nowacki,Paweł Kowol,Mateusz Kozioł ,Piotr Olesik,Jakub Wieczorek,Krzysztof Wacł awiak |
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Affiliation: | 1.Faculty of Electrical Engineering, Silesian University of Technology, ul. Bolesława Krzywoustego 2, 44-100 Gliwice, Poland; (B.N.); (P.K.);2.Faculty of Materials Engineering, Silesian University of Technology, ul. Krasińskiego 8, 40-019 Katowice, Poland; (P.O.); (J.W.); (K.W.) |
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Abstract: | The article discusses the influence of the post-process on the mechanical properties of elements produced with the use of the mask stereolithography (mSLA) method. Printed samples were subjected to the following post-process steps: Washing and post-curing, at various times. Then, static tensile and static bending tests were carried out, as well as Shore D hardness measurements for the inner and surface part of the sample, as well as profilographometric analysis of the surface. The post-curing time has been found to strongly affect the tensile and bending strength of printouts, and to improve their surface quality. Washing has an ambiguous effect on the strength of the printouts, but, in the end, it was found that extended washing slightly reduces the strength. Washing significantly affects the quality of the printout surface. A washing time that is too short results in a surface that strongly resembles the printing process, with high roughness. Increasing the washing time to 10 min lowers the roughness by one order of magnitude. Post-curing has also been shown to be beneficial for the cured sample with the application of shielding water. This approach results in an improvement in the flexural strength of the printouts. In general, the obtained research results indicate that, for printouts with cross-sectional dimensions of several mm, the optimal washing time is no more than 10 min and the post-curing time is at least 30 min. |
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Keywords: | 3D printing mask stereolithography post-process mechanical properties hardness profilographometry |
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