首页 | 本学科首页   官方微博 | 高级检索  
检索        


The effect of modifying the self-etchant bonding protocol on the shear bond strength of orthodontic brackets
Authors:Bishara Samir E  Ostby Adam W  Laffoon John F  Warren John J
Institution:Department of Orthodontics, College of Dentistry, University of Iowa, Iowa City, IA 52242, USA. sbishara@msn.com
Abstract:OBJECTIVE: To compare the shear bond strength (SBS) of orthodontic brackets when the self-etching primer (SEP) and the bracket adhesive are light cured either separately or simultaneously. MATERIALS AND METHODS: Seventy-five human molars were randomly divided into five equal groups. Brackets precoated with Transbond XT composite adhesive were used. The five protocols were: Group 1 (control), the SEP Transbond Plus was applied, brackets placed, and adhesive light cured for 20 seconds; Group 2, SEP Adper Prompt L-Pop was applied, light cured, brackets placed, and light cured; Group 3, the same SEP as in Group 2 was used, however, the SEP and bracket adhesive were light cured together; Group 4, SEP Clearfil S3 Bond was applied, light cured, brackets placed, and light cured; and Group 5, the same SEP as in group 4 was used, however, the SEP and the adhesive were light cured together. The teeth were debonded using a universal testing machine, and the enamel was examined for residual adhesive. Analysis of variance was used to compare the SBS. RESULTS: The SBS of Clearfil S3 Bond after one light cure and two light cures were significantly greater than the bonds of brackets using Transbond Plus. Brackets bonded using Adper Prompt L-Pop after one light cure and two light cures were not significantly different from the other groups. The groups did not differ significantly in their bracket failure modes. CONCLUSION: Only one light curing application is needed to successfully bond brackets when using SEPs and adhesives. This approach can potentially reduce technique sensitivity as well as chair time.
Keywords:
本文献已被 PubMed 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号