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Influence of Manufacturing Conditions on Binder-Less Boards from Steam-Exploded Hemp Shives and Wheat Straw
Authors:Ramunas Tupciauskas  Janis Rizhikovs  Martins Andzs  Oskars Bikovens
Affiliation:Latvian State Institute of Wood Chemistry, Dzerbenes 27, 1006 Riga, Latvia; (J.R.); (M.A.); (O.B.)
Abstract:In the current decade, based on the European Green Deal, new challenges of the wood-based panel industry have arisen, seeking for formaldehyde-free bio-based adhesives and broadening raw lignocellulosics. In order to contribute to the potential solution to the challenges, binder-less boards of steam-exploded (SE 220 °C/2 min) hemp shives and wheat straw were investigated. The objective of this study was to find out the optimal hot-pressing conditions in terms of temperature (150–200 °C) and time (5–16 min) for the boards with three density levels (800–1000–1200 kg·m−3). An experimental design was created and the influence of the variables on binder-less panels were evaluated using a randomized central composite design of the response surface methodology. Water absorption (WA) and thickness swelling (TS) during 24 h, modulus of elasticity (MOE), and modulus of rupture (MOR) in bending test, internal bonding (IB), and Fourier-transform infrared spectroscopy were determined for the obtained boards. Each detected physical-mechanical property of the obtained boards was described by statistical models being different at each density level. The optimal conditions of the obtained binder-less boards were different depending on the raw material and density. For example, the optimal conditions of the boards from SE wheat straw with a density of 800 kg m−3 were found at T = 220 °C and t = 15 min, with the achieved properties of WA = 53%, TS = 4%, MOE = 2750 N mm−2, MOR = 15.5 N mm−2, and IB = 0.64 N mm−2. Based on the achieved properties at the optimal conditions, the boards meet the requirements of the conventional particleboard Type P3 according to EN 312.
Keywords:hemp shives   wheat straw   steam explosion pre-treatment   response surface methodology   binder-less board   properties
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