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Anodic Electrodeposition of Chitosan–AgNP Composites Using In Situ Coordination with Copper Ions
Authors:Dmitry S. Kharitonov,Aliaksandr A. Kasach,Agnieszka Gibala,Mał  gorzata Zimowska,Irina I. Kurilo,Angelika Wrzesiń  ska,Lilianna Szyk-Warszyń  ska,Piotr Warszyń  ski
Abstract:Chitosan is an attractive material for biomedical applications. A novel approach for the anodic electrodeposition of chitosan–AgNP composites using in situ coordination with copper ions is proposed in this work. The surface and cross-section morphology of the obtained coating with varying concentrations of AgNPs were evaluated by SEM, and surface functional groups were analyzed with FT-IR spectroscopy. The mechanism of the formation of the coating based on the chelation of Cu(II) ions with chitosan was discussed. The antibacterial activity of the coatings towards Staphylococcus epidermidis ATCC 35984/RP62A bacteria was analyzed using the live–dead approach. The presented results indicate that the obtained chitosan–AgNP-based films possess some limited anti-biofilm-forming properties and exhibit moderate antibacterial efficiency at high AgNP loads.
Keywords:chitosan   copper   electrodeposition   composite   AgNPs   antibacterial properties
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