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经阴道分娩会阴侧切产妇应用皮下改良缝合技术配合外阴 半导体激光疗法的效果及对瘢痕形成的影响
引用本文:金雯雯.经阴道分娩会阴侧切产妇应用皮下改良缝合技术配合外阴 半导体激光疗法的效果及对瘢痕形成的影响[J].医学美学美容,2024,33(8).
作者姓名:金雯雯
作者单位:烟台市芝罘区妇幼保健院宫颈疾病门诊
摘    要:目的 分析经阴道分娩会阴侧切产妇应用皮下改良缝合技术配合外阴半导体激光疗法的临床效果 及对瘢痕形成的影响。方法 选取2023年3月-2024年2月在我院经阴道分娩会阴侧切的74例产妇为研究对 象,采用随机数字表法分为对照组和观察组,各组37例。对照组采用分层间断缝合技术,观察组采用皮下 改良缝合技术+外阴半导体激光疗法,比较两组临床手术指标、产妇疼痛评分(VAS)、切口愈合情况、 瘢痕评分(PSAS)、切口并发症发生率。结果 观察组缝合时间、切口愈合时间、瘢痕宽度、下床活动时 间均优于对照组(P <0.05);观察组产后第1、3、5天VAS评分均低于对照组(P <0.05);观察组瘢痕愈 合率为94.59%,高于对照组的81.08%(P <0.05);观察组瘢痕色素沉着、表面平整度、柔韧度、表面积评 分均低于对照组(P<0.05);观察组切口并发症发生率低于对照组(P <0.05)。结论 经阴道分娩会阴侧 切产妇应用皮下改良缝合技术配合外阴半导体激光疗法可促进切口愈合,改善瘢痕评分,减轻产妇疼痛程 度,降低切口并发症发生率,具有良好的应用效果。

关 键 词:阴道分娩  会阴侧切  皮下改良缝合  外阴半导体激光疗法

Effect of Subcutaneous Modified Suture Technique Combined with Vulva Semiconductor Laser Therapy in Vaginal Delivery Parturients with Episiotomy and its Influence on Scar Formation
Authors:JIN Wen-wen
Institution:Cervical Disease Clinic, Zhifu District Maternal and Child Health Hospital
Abstract:Objective To analyze the clinical effect of subcutaneous modified suture technique combined with vulva semiconductor laser therapy in vaginal delivery parturients with episiotomy and its influence on scar formation. Methods From March 2023 to February 2024, 74 parturients who underwent episiotomy during vaginal delivery in our hospital were selected as the research objects. They were divided into control group and observation group by random number table method, with 37 parturients in each group. The control group was treated with layered interrupted suture, and the observation group was treated with subcutaneous modified suture technique+vulva semiconductor laser therapy. The clinical operation indexes, maternal pain score (VAS), incision healing, scar score (PSAS) and incidence of incision complications were observed and compared between the two groups. Results The suture time, wound healing time, scar width and ambulation time of the observation group were better than those of the control group (P <0.05). The VAS score of the observation group on the 1st, 3rd and 5th day after delivery was lower than that of the control group (P <0.05). The scar healing rate of the observation group was 94.59%, which was higher than 81.08% of the control group (P <0.05). The scores of scar pigmentation, surface smoothness, flexibility and surface area in the observation group were lower than those in the control group (P <0.05). The incidence of incision complications in the observation group was lower than that in the control group (P <0.05). Conclusion Subcutaneous modified suture technique combined with vulva semiconductor laser therapy can promote wound healing, improve scar score,reduce maternal pain and the incidence of incision complication s, and has a good application effect.
Keywords:Vaginal delivery  Episiotomy  Subcutaneous modified suture  Vulva semiconductor laser
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