Effect of a functional monomer (MDP) on the enamel bond durability of single‐step self‐etch adhesives

The present study aimed to determine the effect of the functional monomer, 10‐methacryloxydecyl dihydrogen phosphate (MDP), on the enamel bond durability of single‐step self‐etch adhesives through integrating fatigue testing and long‐term water storage. An MDP‐containing self‐etch adhesive, Clearfil Bond SE ONE (SE), and an experimental adhesive, MDP‐free (MF), which comprised the same ingredients as SE apart from MDP, were used. Shear bond strength (SBS) and shear fatigue strength (SFS) were measured with or without phosphoric acid pre‐etching. The specimens were stored in distilled water for 24 h, 6 months, or 1 yr. Although similar SBS and SFS values were obtained for SE with pre‐etching and for MF after 24 h of storage in distilled water, SE with pre‐etching showed higher SBS and SFS values than MF after storage in water for 6 months or 1 yr. Regardless of the pre‐etching procedure, SE showed higher SBS and SFS values after 6 months of storage in distilled water than after 24 h or 1 yr. To conclude, MDP might play an important role in enhancing not only bond strength but also bond durability with respect to repeated subcritical loading after long‐term water storage.     

Comparison between universal adhesives and two‐step self‐etch adhesives in terms of dentin bond fatigue durability in self‐etch mode

This aim of this study was to compare universal adhesives and two‐step self‐etch adhesives in terms of dentin bond fatigue durability in self‐etch mode. Three universal adhesives – Clearfil Universal, G‐Premio Bond, and Scotchbond Universal Adhesive – and three‐two‐step self‐etch adhesives – Clearfil SE Bond, Clearfil SE Bond 2, and OptiBond XTR – were used. The initial shear bond strength and shear fatigue strength of resin composite bonded to adhesive on dentin in self‐etch mode were determined. Scanning electron microscopy observations of fracture surfaces after bond strength tests were also made. The initial shear bond strength of universal adhesives was material dependent, unlike that of two‐step self‐etch adhesives. The shear fatigue strength of Scotchbond Universal Adhesive was not significantly different from that of two‐step self‐etch adhesives, unlike the other universal adhesives. The shear fatigue strength of universal adhesives differed depending on the type of adhesive, unlike those of two‐step self‐etch adhesives. The results of this study encourage the continued use of two‐step self‐etch adhesive over some universal adhesives but suggest that changes to the composition of universal adhesives may lead to a dentin bond fatigue durability similar to that of two‐step self‐etch adhesives.     

Effects of non‐thermal atmospheric pressure pulsed plasma on the adhesion and durability of resin composite to dentin

This study investigated the effect of low‐power, non‐thermal atmospheric pressure plasma (NT‐APP) treatments, in pulsed and conventional modes, on the adhesion of resin composite to dentin and on the durability of the bond between resin composite and dentin. A pencil‐type NT‐APP jet was applied in pulsed and conventional modes to acid‐etched dentin. The microtensile bond strength (MTBS) of resin composite to dentin was evaluated at 24 h and after thermocycling in one control group (no plasma) and in two experimental groups (pulsed plasma and conventional plasma groups) using the Scotchbond Multi‐Purpose Plus Adhesive System. Data were analyzed using two‐factor repeated‐measures anova and Weibull statistics. Fractured surfaces and the bonded interfaces were evaluated using a field‐emission scanning electron microscope. Although there were no significant differences between the plasma treatment groups, the plasma treatment improved the MTBS compared with the control group. After thermocycling, the MTBS did not decrease in the control or conventional plasma group but increased in the pulsed plasma group. Thermocycling increased the Weibull moduli of plasma‐treated groups. In conclusion, plasma treatment using NT‐APP improved the adhesion of resin composite to dentin. Using a pulsed energy source, the energy delivered to the dentin was effectively reduced without any reduction in bond strength or durability.     

Influence of duration of phosphoric acid pre‐etching on bond durability of universal adhesives and surface free‐energy characteristics of enamel

The purpose of this study was to evaluate the influence of duration of phosphoric acid pre‐etching on the bond durability of universal adhesives and the surface free‐energy characteristics of enamel. Three universal adhesives and extracted human molars were used. Two no‐pre‐etching groups were prepared: ground enamel; and enamel after ultrasonic cleaning with distilled water for 30 s to remove the smear layer. Four pre‐etching groups were prepared: enamel pre‐etched with phosphoric acid for 3, 5, 10, and 15 s. Shear bond strength (SBS) values of universal adhesive after no thermal cycling and after 30,000 or 60,000 thermal cycles, and surface free‐energy values of enamel surfaces, calculated from contact angle measurements, were determined. The specimens that had been pre‐etched showed significantly higher SBS and surface free‐energy values than the specimens that had not been pre‐etched, regardless of the aging condition and adhesive type. The SBS and surface free‐energy values did not increase for pre‐etching times of longer than 3 s. There were no significant differences in SBS values and surface free‐energy characteristics between the specimens with and without a smear layer. The results of this study suggest that phosphoric acid pre‐etching of enamel improves the bond durability of universal adhesives and the surface free‐energy characteristics of enamel, but these bonding properties do not increase for phosphoric acid pre‐etching times of longer than 3 s.     

Influence of Surface Area and Geometry of Specimens on Bond Strength in a Microtensile Test: An Analysis by the Three‐Dimensional Finite Element Method

Purpose: This study employed three‐dimensional (3D) finite element analysis to investigate the stress distribution patterns in a microtensile test with the goal of evaluating the effects of the bond surface area and geometry on bond strength. Materials and Methods: Finite element models of six specimens were generated: three stick models and three hourglass models. All models simulated the bond strength between dentin and ceramic. The mechanical properties of the materials—the modulus of elasticity and Poisson's coefficient—were defined according to a literature review. The base of each specimen was considered inserted (constrained area) and possessed nodes with displacements restricted in all directions. A traction load, which was calculated to generate a uniformly distributed stress of 20 N/mm² at the bond interface, was applied to the top of the specimen. The distribution pattern of the generated stress was qualitatively and quantitatively measured based on color scales ranging from blue to red, according to the von Mises equivalent stress. Results: Specimens with similar shapes demonstrated similar stress distributions. Ceramic specimens had a higher stress value (30.35 MPa) compared to specimens consisting of resinous cement (23.59 MPa) and dentin (19.77 MPa). At the bond interface, the specimens with square sections demonstrated stress values ranging from 22.00 to 24.20 MPa. For the circular section, the stress values ranged from 23.40 to 27.00 MPa. Conclusion: The maximum stress values determined for the circular and square sections were similar among specimens with the same interface area. At the bond interface, the highest stress values were observed in hourglass‐shaped specimens.     

Er:YAG 激光和酸蚀预处理对自粘结树脂水门汀粘结强度的影响

目的:探讨Er:YAG 激光和酸蚀预处理对自粘结树脂水门汀粘结强度的影响?方法:44颗前磨牙根据对牙本质表面预处理方式的不同随机分为4组:对照组?Er:YAG 激光组?酸蚀组(35%磷酸)?Er:YAG 激光+酸蚀组?每组11颗牙中随机选出1颗切取3 mm厚牙本质片,按相应分组要求预处理后进行扫描电镜观察;每组剩余10颗牙制备一致标准牙本质表面后按相应分组要求预处理,用自粘结树脂水门汀RelyXTM Unicem将其与Everest ZS 氧化锆瓷片粘结,24 h后测试各组剪切粘结强度并进行统计分析?结果:扫描电镜观察显示采用不同方式预处理后,牙本质表面形态改变明显;统计分析结果显示剪切粘结强度由高到低为Er:YAG 激光组(7.18 ± 2.54)MPa?Er:YAG 激光+酸蚀组(5.50 ± 2.09)MPa?对照组(4.05 ± 1.04)MPa?酸蚀组(3.61 ± 0.70)MPa;Er:YAG 激光组?Er:YAG 激光+酸蚀组与对照组有显著性差异(P < 0.05),酸蚀组与对照组无显著性差异(P > 0.05)?结论:酸蚀对自粘结树脂粘结强度的改变无明显影响,Er:YAG 激光预处理能有效提高自粘结树脂与牙本质和氧化锆瓷的粘结强度?     

在非水介质中用表面引发接枝聚合法制备接枝微粒PHEMA-SiO2及其对槲皮素的氢键吸附性能

首先,将偶联剂γ-巯丙基三甲氧基硅烷(MPMS)上的巯基(-SH)键合在微米级硅胶(SiO₂)微粒表面,得到了改性微粒MPMS-SiO₂。在非水溶剂N,N-二甲基甲酰胺(DMF)中,使溶液中的过氧化苯甲酰(BPO)与改性微粒MPMS-SiO₂表面的巯基构成表面引发体系(-SH/BPO),于非水介质中在硅胶微粒表面实现了甲基丙烯酸羟乙酯(HEMA)的接枝聚合,成功制备出接枝微粒PHEMA-SiO₂,接枝度高达28 g/100 g。采用红外光谱(FT-IR)、热重分析(TG)及扫描电子显微镜(SEM)等手段对PHEMA-SiO₂进行了表征,研究了主要因素对HEMA表面引发接枝聚合的影响规律。在此基础上探索研究了PHEMA-SiO₂对槲皮素(Quercetin)的氢键吸附作用。研究结果表明:-SH/BPO引发体系可以顺利地引发HEMA在非水介质中的接枝聚合,适宜的温度为65℃,适宜的BPO用量为单体质量的1.0%。PHEMA-SiO₂与槲皮素分子之间会产生多位点普通氢键与π型氢键两种氢键相互作用,使PHEMA-SiO₂对槲皮素具有强吸附能力。溶剂分子对槲皮素的竞争吸附以及温度的升高均可使槲皮素在极性溶剂或质子性溶剂中吸附容量下降。     

Synthesis and characterization of new dimethacrylate monomer and its application in dental resin

In this study, a dimethacrylate monomer, 1,4-Bis[2-(4-(2′-hydroxy-3′-methacryloyloxy-propoxy)phenyl)-2propyl]benzene (BMPPB) was synthesized to replace 2,2-bis[4-(2′-hydroxyl-3′-methacryloyloxy-propoxy)phenyl]propane (Bis-GMA) as one component of dental restorative materials. The structure of BMPPB and its intermediate product 1,4-bis[2-(4-(oxiranylmethoxy)phenyl)-2propyl]benzene (BOPPB) were confirmed by Fourier transform infrared (FTIR) spectroscopy, proton nuclear magnetic resonance spectroscopy (¹H-NMR), and elemental analysis. In order to evaluate the possibility of replacing Bis-GMA with BMPPB in dental resin, double bond conversion (DC), polymerization shrinkage, contact angle, water sorption (WS) and solubility (SL), and flexural strength (FS) and modulus of BMPPB/tri(ethylene glycol)dimethacrylate (TEGDMA) (50/50?wt) resin system and Bis-GMA/BMPPB/TEGDMA (25/25/50?wt) resin system were studied. Commercially used Bis-GMA/TEGDMA (50/50?wt) dental resin system was used as reference. The results showed that BMPPB-contained copolymer had higher DC, higher WS and SL than the copolymer that only contained Bis-GMA (p?<?0.05). All of the copolymers had nearly the same contact angle (p?>?0.05). BMPPB/TEGDMA resin system had lower polymerization shrinkage, higher FS and modulus (p?<?0.05) than Bis-GMA/TEGDMA resin system. There was no significant difference on polymerization shrinkage, FS and modulus (p?>?0.05) between Bis-GMA/BMPPB/TEGDMA resin system and Bis-GMA/TEGDMA resin system. Before and after water immersion, both FS and modulus of every copolymer did not change significantly (p?>?0.05). Therefore, BMPPB had potential to be used to replace Bis-GMA as base resin in dental restorative materials, but many studies should be undertaken further.