Thermal and Mechanical Properties of Amorphous Silicon Carbide Thin Films Using the Femtosecond Pump-Probe Technique

Nanoscale amorphous silicon carbide (a-SiC) thin films are widely used in engineering applications. It is important to obtain accurate information about their material properties because they often differ from those of the bulk state depending on the fabrication technique and process parameters. In this study, the thermal and mechanical properties of a-SiC thin films were evaluated using the femtosecond pump-probe technique, which provides high spatial and temporal resolutions sufficient to measure films that have a thickness of less than 300 nm. a-SiC films were grown using a plasma-enhanced chemical vapor deposition system, and the surface characteristics were analyzed using ellipsometry, atomic force microscopy, and X-ray reflectometry. The results show that the out-of-the-plane thermal conductivity of the films is lower than that of bulk crystalline SiC by two orders of magnitude, but the lower limit is dictated by the minimum thermal conductivity. In addition, a decrease in the mass density resulted in a reduced Young’s modulus by 13.6–78.4% compared to the literature values, implying low Si-C bond density in the microstructures. The scale effect on both thermal conductivity and Young’s modulus was not significant.     

Relationship between Thermal Diffusivity and Mechanical Properties of Wood

This paper describes an experimental study of the relationships between thermal diffusivity and mechanical characteristics including Brinell hardness, microhardness, and Young’s modulus of common pine (Pinus sylvestris L.), pedunculate oak (Quercus robur L.), and small-leaf lime (Tilia cordata Mill.) wood. A dependence of Brinell hardness and thermal diffusivity tensor components upon humidity for common pine wood is found. The results of the measurement of Brinell hardness, microhardness, Young’s modulus, and main components of thermal diffusivity tensor for three perpendicular cuts are found to be correlated. It is shown that the mechanical properties correlate better with the ratio of longitude to transversal thermal diffusivity coefficients than with the respective individual absolute values. The mechanical characteristics with the highest correlation with the abovementioned ratio are found to be the ratio of Young’s moduli in longitude and transversal directions. Our technique allows a comparative express assessment of wood mechanical properties by means of a contactless non-destructive measurement of its thermal properties using dynamic thermal imaging instead of laborious and material-consuming destructive mechanical tests.