| Institution: | 1. Institute of Coordination Bond Metrology and Engineering, School of Materials Science and Engineering, China Jiliang University, 310018 China;2. Engineering Research Center for Nanophotonics and Advanced Instrument, Ministry of Education, Department of Physics, East China Normal University, 200062 China;3. College of Modem Science and Technology, China Jiliang University, 310018 China;1. Department of Aeronautics and Astronautics, Graduate School of Engineering, Kyoto University, Katsura, Nishikyo-ku, Kyoto 615-8540, Japan;2. Aerospace Company, Kawasaki Heavy Industries, Ltd., Kakamigahara, Gifu 504-8710, Japan;1. State Key Laboratory of Structural Analysis for Industrial Equipment and School of Ocean Science and Technology, Dalian University of Technology, Panjin 124221, PR China;2. State Key Laboratory of Structural Analysis for Industrial Equipment and Department of Engineering Mechanics, Dalian University of Technology, Dalian 116024, PR China;3. Department of Civil and Architectural Engineering, City University of Hong Kong, Hong Kong, China;4. Intel Semiconductor (Dalian) co., LTD, Dalian 116600, PR China;1. Department of Structures for Engineering and Architecture, University of Naples Federico II, via Claudio 21, 80125 Naples, Italy;2. Department of Civil Engineering, University of Salerno, 84084 Fisciano, Sa, Italy;3. Department of Civil and Mechanical Engineering, University of Cassino and Southern Lazio, via G. Di Biasio 43, 03043 Cassino, FR, Italy |
