瓷面处理技术与陶瓷托槽的抗剪切力强度

目的在不同瓷面处理技术单独或联合使用,并用发光二极管进行光照的条件下,对陶瓷托槽的抗剪切强度进行比较。方法将30个表面光滑的瓷面随机分为3组,每组10个。每组瓷面处理如下:第1组:9.6%氢氟酸酸蚀2 m in,涂布硅烷偶联剂;第2组:氧化铝颗粒喷砂,9.6%氢氟酸酸蚀2 m in,涂布硅烷偶联剂;第3组:氧化铝颗粒喷砂,涂布硅烷偶联剂,用光固化树脂粘接剂将陶瓷托槽粘接于瓷面上,分别测量抗剪切强度。结果方差分析表明组间存在显著差异(P<0.001)。第3组的抗剪切强度最低(5.35±1.28,P<0.001)。第1组(11.10±1.45)和第2组(10.38±1.09;P>0.05)之间没有明显差别。结论应用氢氟酸和硅烷偶联剂处理瓷表面可获得最大的抗剪切强度。在应用氢氟酸和硅烷偶联剂之前喷砂没有增加粘接强度。

Porcelain Surface-conditioning Techniques and the Antishear Bond Strength of Ceramic Brackets

Objective To compare the effects of various porcelain surface-conditioning techniques,used either alone or in combination,on the shear bond strength（SBS） of ceramic brackets cured with a light emitting diode（LED）.Methods Thirty glazed porcelain facets were randomly divided into three groups（n=10）.In group I,the porcelain surfaces were etched with 9.6 percent hydrofluoric acid（HFA） for 2 minutes before silane application;In group II,the porcelain surfaces were sandblasted with aluminium oxide particles,etched with 9.6 percent HFA for 2 minutes,and silane applied;In group III,the porcelain surfaces were sandblasted with aluminium oxide particles before silane application.Spirit ceramic brackets were bonded with a light-cured composite resin（Light Bond） and a LED.Bond strength was determined in shear mode.Results Analysis of variance indicated a significant difference between groups（P0.001）.The lowest SBS was found in group III（5.35±1.28 P0.001）.No significant difference was found between group I（11.10±1.45） and group II（10.38±1.09;P0.05）.Conclusion Surface treatment with HFA and a silane coupling agent produced the highest bond strength.Sandblasting before HFA and silane application did not significantly increase bond strength.