首页 | 本学科首页   官方微博 | 高级检索  
     

LIM矿化蛋白-1与LIM矿化蛋白-3共转染骨髓间充质干细胞的基因表达
引用本文:唐春晖,唐旭东,赖铁鹰. LIM矿化蛋白-1与LIM矿化蛋白-3共转染骨髓间充质干细胞的基因表达[J]. 华西医学, 2011, 0(9): 1331-1335
作者姓名:唐春晖  唐旭东  赖铁鹰
作者单位:内江市第一人民医院骨科;
摘    要:
目的探讨LIM矿化蛋白(LIMmineralizationprotein,LMP)-1和LMP-3双基因共转染骨髓间充质干细胞(bonemesenchymalstemcells,BMSC)的表达情况。方法采用人工设计合成人LMP-1和LMP-3基因片段,分别与质粒pEGFP-N2连接,经酶切、测序鉴定后。分离培养新西兰兔BMSC,用脂质体包裹转染BMSC,按转染情况分为5组:未转染组(A组)、转染空载体组(B组)、转染LMP-1基因组(C组)、转染LMP-3基因组(D组)、LMP-1与LMP-3双基因共转染组(E组)。采用实时聚合酶链反应(real-timepolymerasechainreaction,RT-PcR)和蛋白质印迹法检测LMP-1和LMP-3的表达。结果酶切及测序表明真核表达质粒pEGFP-N2-LMP-1和pEGFP-N2-LMP-3构建成功。E组可同时较高水平表达LMP-1和LMP-3分子。对RT-PcR及蛋白质印迹法检测结果行灰度值测量并行统计学分析显示:LMP-1mRNA及蛋白水平的表达,5组间差异有统计学意义(P〈O.05),但E组与C组的差异无统计学意义(P〉O.05);LMP-3mRNA及蛋白水平的表达,5组间差异有统计学意义(P〈O.05),且E组与D组差异也有统计学意义(P〈O.05)。结论双基因共转染的BMSC能在体外同时表达LMP-1与LMP-3,为基因修复骨缺损带来新思路。

关 键 词:LIM矿化蛋白-1  LIM矿化蛋白-3  质粒pEGFP-N2  骨髓间充质干细胞  

Cotransfection and Expression of LIM mineralization protein-1 and-3 in Mesenchymal Stem Cells in vitro
TANG Chun-hui,TANG Xu-dong,LAI Tie-ying. Cotransfection and Expression of LIM mineralization protein-1 and-3 in Mesenchymal Stem Cells in vitro[J]. West China Medical Journal, 2011, 0(9): 1331-1335
Authors:TANG Chun-hui  TANG Xu-dong  LAI Tie-ying
Affiliation:TANG Chun-hui,TANG Xu-dong,LAI Tie-ying.Department of Orthopedics,the First Hospital of Neijiang City,Neijiang,Sichuan 641000,P.R.China
Abstract:
Objective To study the expression of LIM mineralization protein(LMP)-1 and LMP-3 genes after cotransfecting them into bone mesenchymal stem cells(BMSC) of rabbit in vitro.Methods Fragments of LMP-1 gene and LMP-3 gene were gained through artificial synthesis,and were constructed respectively into the plasmid vector pEGFP-N2.The inserted target genes in plasmid were verified by nucleotide sequencing and enzymes.The plasmids carrying LMP-1 and LMP-3 genes were cotransfected into chondrocytes by liposome metho...
Keywords:LIM mineralization protein-1  LIM mineralization protein-3  pEGFP-N2 plasmid  Mesenchymal stem cellsl  Rabbits  
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号