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改性硅炔树脂及其复合材料的耐热性能
引用本文:王娜,周权,倪礼忠. 改性硅炔树脂及其复合材料的耐热性能[J]. 医学教育探索, 2012, 25(2)
作者姓名:王娜  周权  倪礼忠
作者单位:华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海 200237;华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海 200238;华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海 200239
摘    要:通过格氏试剂反应制得了改性硅炔杂化树脂(GMD)。采用DSC、TGA等分析方法研究了GMD的固化反应及耐热性能。结果表明:GMD固化物在氮气气氛下质量损失5%时的温度(Td5)为631 °C,1 000 °C时的质量残留率为59%。所制备的玻璃纤维增强复合材料在常温下的弯曲强度为320 MPa,在240 °C的弯曲强度保留率高达90%,空气条件下经500 °C处理7 min后,质量保留率仍达到99.7%。该复合材料的玻璃化温度大于400 °C,具有优异的耐热性能、力学性能及介电性能。

关 键 词:硅树脂;改性;耐热性;复合材料

Modification and Heat Resistance of Hybrid Composite Containing Silicon and Acetylene Resin
WANG N,ZHOU Quan and NI Li zhong. Modification and Heat Resistance of Hybrid Composite Containing Silicon and Acetylene Resin[J]. Researches in Medical Education, 2012, 25(2)
Authors:WANG N  ZHOU Quan  NI Li zhong
Affiliation:Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237,China;Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200238,China;Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200239,China
Abstract:The silicon containing poly(arylaeetylene) resin (GMD) was synthesized by condensation reaction. The curing the cured GMD was 631°C in nitrogen. The residual of mass was 59% based on the initial mass at 1 000 °C. The flexural the cured GMD was 631°C in nitrogen. The residual of mass was 59% based on the initial mass at 1 000 °C. The flexural strength at room temperature of the composite was 324 MPa and the retention rate of flexural strength was 90% at 240 °C. After heat treated for 7 min at 500°C in air, the retain ratio of the composite was 99.7%. The composite of which Tg was more than 400 °C possessed excellent high temperature resistance properties, excellent mechanical and dielectric properties.
Keywords:silicon resin   modification   heat resistance   composite
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