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| 聚(间乙炔基-甲基氢苯基硅烷)树脂的合成及其耐热性能 | |
| 引用本文： | 熊蒲兰,周权,倪礼忠. 聚(间乙炔基-甲基氢苯基硅烷)树脂的合成及其耐热性能[J]. 医学教育探索, 2013, 26(1) |
| 作者姓名： | 熊蒲兰 周权 倪礼忠 |
| 作者单位： | 华东理工大学材料科学与工程学院，特种功能高分子材料及相关技术教育部重点实验室，上海 200237;华东理工大学材料科学与工程学院，特种功能高分子材料及相关技术教育部重点实验室，上海 200238;华东理工大学材料科学与工程学院，特种功能高分子材料及相关技术教育部重点实验室，上海 200239 |
| 基金项目： | 国家自然科学基金（51073053） |
| 摘 要： | 以二氯甲基硅烷和间二乙炔基苯为原料，通过有机镁格氏试剂与卤代硅烷的缩合反应，合成得到了一种新结构的聚(间乙炔基 甲基氢苯基硅烷)树脂（PCS）。采用FT-IR、1H-NMR、13C-NMR和GPC对树脂的结构进行了表征，采用DSC和TGA对树脂的固化反应和热稳定性能进行了研究。结果表明：PCS树脂在 160 °C及 240 °C处有固化反应放热峰；其固化产物具有优异的耐热及耐热氧化性能，在氮气与空气氛围下质量损失5%的温度（Td5）分别为644、595 °C，而1 000 °C的质量保留率分别为 89.0%、57.9%。 |
| 关 键 词： | 聚(间乙炔基 甲基氢苯基硅烷)树脂；耐高温聚合物；固化行为；耐热性能 |
Synthesis and Properties of Poly(m-dietheynylbenzene methylsilane) Resin |
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| XIONG Pu lan,ZHOU Quan and NI Li zhong. Synthesis and Properties of Poly(m-dietheynylbenzene methylsilane) Resin[J]. Researches in Medical Education, 2013, 26(1) | |
| Authors: | XIONG Pu lan ZHOU Quan NI Li zhong |
| Affiliation: | Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China;Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200238, China;Key Laboratory of Specially Functional Polymeric Materials and Related Technology of Ministry of Education, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200239, China |
| Abstract: | A high temperature resistant organic inorganic hybrid resin, poly (m-dietheynylbenzene methyl silane) (PCS), was synthesized from dichloromethylsilane and diethynylbenzene using Grignard reagent method. The structure of PCS was characterized by FT-IR, 1H-NMR, 13C-NMR and GPC. The curing behavior of PCS resin was studied by DSC and thermal stability of the cured resin was analyzed by TGA. Results showed that there were two exothermic peaks at 160 °C and 240 °C in DSC curve of PCS resin. The cured PCS resins had excellent thermo oxidative stability. Under nitrogen and air condition, the tempe rature of 5% mass loss(Td5) and the residual of mass at 1 000 °C were up to 644 °C and 89.0%, 595 °C and 57.9% , respectively. |
| Keywords: | poly(m-dietheynylbenzene methylsilane) heat resistant polymer curing behavior heat resistance properties |
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