Current status and challenges of Additive manufacturing in orthopaedics: An overview

Additive manufacturing is a rapidly emerging technology which is being successfully implemented in the various field of medicine as well as in orthopaedics, where it has applications in reducing cartilage defects and treatments of bones. The technology helps through systematic collection of information about the shape of the "defects" and precise fabrication of complex 3D constructs such as cartilage, heart valve, trachea, myocardial bone tissue and blood vessels. In this paper, a large number of the relevant research papers on the additive manufacturing and its application in medical specifically orthopaedics are identified through Scopus had been studied using Bibliometric analysis and application analysis is undertaken. The bibliometric analysis shows that there is an increasing trend in the research reports on additive manufacturing applications in the field of orthopaedics. Discussions are on using technological advancement like scanning techniques and various challenges of the orthopaedic being met by additive manufacturing technology. For patient-specific orthopaedic applications, these techniques incorporate clinical practice and use for effective planning. 3D printed models printed by this technology are accepted for orthopaedic surgery such as revision of lumbar discectomy, pelvic surgery and large scapular osteochondroma. The applications of additive manufacturing in orthopaedics will experience a rapid translation in future. An orthopaedic surgeon can convert need/idea into a reality by using computer-aided design (CAD) software, analysis software to facilitate the manufacturing. Thus, AM provides a comprehensive opportunity to manufacture orthopaedic implantable medical devices.     

集成电路芯片生产的职业病危害特点

目的 研究集成电路芯片制造中作业人员的操作特点、接触职业病危害种类以及事故类型。方法 对集成电路芯片制造的生产流程、职业病危害及接触状况的资料进行收集整理。结果 根据生产流程中使用的设备及芯片制造所用原辅材料，论述了生产过程中各设备和操作工序涉及的各类高度、中度毒性化学物质、工艺特殊气体以及电离辐射和非电离辐射等职业病危害因素、作业人员操作特点和易发事故种类。结论 集成电路芯片制造中职业病危害问题值得关注。     

Semiconductor manufacturing: an introduction to processes and hazards

Recent studies suggest that semiconductor workers have an increased incidence of work-related illness. Semiconductor manufacturing is a chemically intensive industry involving many potentially hazardous operations. As this industry moves into new geographic areas, health care professionals will be asked to evaluate medical or workplace conditions associated with unfamiliar and complex production processes. This paper provides an overview of semiconductor manufacturing processes for these health practitioners. Each step of device fabrication is detailed with its attendant chemical and physical hazards. Broader concepts of industrial control technology, clean room ventilation, and ergonomics are explained. The hazards are tabulated to allow rapid assessment of the risks inherent to each processing step. References have been chosen to guide the reader to more indepth information.     

Large Scale Manufacturing of B43(Anti-CD19)-Genistein for Clinical Trials in Leukemia and Lymphoma

We have conjugated the murine monoclonal anti-CD 19 antibody B43 to the tyrosine kinase inhibitor genistein to construct an effective immunoconjugate against CD 19 antigen positive hematologic malignancies. The scaled-up production and purification of B43 antibody, genistein, and B43-Genistein immunoconjugate permitted the manufacturing of a highly purified clinical-grade B43-Genistein preparation. In clonogenic assays, B43-Genistein elicited selective and potent cytotoxicity against CD 19 antigen positive human leukemia cells. To our knowledge, this work represents the first effort of producing a clinical-grade genistein immunoconjugate for treatment of B-lineage leukemia and lymphoma.     

Filament Transport Control for Enhancing Mechanical Properties of Parts Realised by Fused Filament Fabrication

The fused filament fabrication (FFF) process is widely used for producing prototypes and functional parts for diverse applications. While FFF is particularly attractive due to its cost-effectiveness, on the other hand, the fabricated parts have limitations in terms of large manufacturing time and reduced mechanical properties. The latter is strongly influenced by the fabrication process parameters, which affect the interlayer bonding and the adhesion between consecutive layers. Several works presented in the literature analysed the correlation between mechanical properties and process parameters. It was demonstrated that an increase in the fabrication feed rate causes slippage between filament and the feeding system, which leads to a decrease in the extruded material flow, and thus in part density. This work aims to investigate how the limitation of the slippage phenomenon affects the mechanical properties of parts fabricated using the FFF process. A prototype machine, equipped with a closed-loop control system on filament transport, was used to fabricate samples for tensile tests and dynamical mechanical analysis. Samples fabricated enabling the filament transport control showed an increase both in ultimate tensile strength and elongation at break for those fabricated with disabled control, whilst a decrease in stiffness was observed. In addition, the results showed that the use of a filament transport control system on a FFF machine increases the possibility of fabricating high value-added parts.     

Microstructure Evolution of Al6061 Alloy Made by Additive Friction Stir Deposition

In this paper, the phase structure, composition distribution, grain morphology, and hardness of Al6061 alloy samples made with additive friction stir deposition (AFS-D) were examined. A nearly symmetrical layer-by-layer structure was observed in the cross section (vertical with respect to the fabrication-tool traversing direction) of the as-deposited Al6061 alloy samples made with a back-and-forth AFS-D strategy. Equiaxed grains were observed in the region underneath the fabrication tool, while elongated grains were seen in the “flash region” along the mass flow direction. No clear grain size variance was discovered along the AFS-D build direction except for the last deposited layer. Grains were significantly refined from the feedstock (~163.5 µm) to as-deposited Al6061 alloy parts (~8.5 µm). The hardness of the as-fabricated Al6061 alloy was lower than those of the feedstock and their heat-treated counterparts, which was ascribed to the decreased precipitate content and enlarged precipitate size.     

基于CAD/CAM技术的钛合金制品在正颌外科手术中应用研究进展

计算机辅助设计与计算机辅助制作(computer aided design and computer aided manufacturing,CAD/CAM)技术发展迅速,在医学领域尤其是外科领域已被广泛应用.正颌外科是外科学的重要组成部分,其对于治疗的精度与材料的质量要求严格,而基于CAD/CAM技术的钛合金制品(如...     

中药制药过程中超滤膜完整性评价手段的研究进展

综述中药制药过程中超滤膜完整性评价手段,整理超滤膜完整性评价手段的文献,并结合中药制药过程中超滤技术应用特点进行发展趋势分析。直接、间接完整性检测法均具有一定的实用性,但是应用范围有待进一步评价,其中常用的气泡点法和扩散流法可对膜完整性进行快速评价,但无法在使用过程中进行检测;替代挑战实验法多采用外源性探针,灵敏度高却存在污染。现有的膜完整性检测方法无法满足中药制药过程中无外源性添加污染、指标灵敏、在线监控的要求,经分析发现间接检查法是未来膜完整性评价方法的研究方向,寻找内源性探针对提升膜完整性的检测水平具有重要意义。     

正颌术中髁突定位技术的研究进展

正颌手术后髁突移位可导致患者复发以及出现颞下颌关节症状。为减少术后髁突移位,众多髁突定位技术运用于临床中。旨探讨髁突定位技术预防术后出现关节症状及复发的有效性,本文回顾近20年内国内外正颌术中髁突定位技术的相关文献,经文献归纳发现,定位技术以稳定术前髁突位置为最终目的,可分为非计算机辅助和计算机辅助定位技术。目前计算机辅助设计与制造髁突定位装置(computer-aided design/computer-aided manufacturing condylar positioning devices,CAD/CAM CPDs)定位效果最佳,由牙支持式与骨支持式导板组成。其余各技术定位效果由高到低排序:CAD/CAM钛板定位>手法定位>计算机辅助导航系统>影像定位系统。各定位技术的精准度可达到与髁突术前位置相差1～2 mm与1°～2°,有效预防术后复发以及关节症状,为不同级别的外科医生和不同难度的病例提供临床参考。该领域仍缺乏大样本和长时间随访的随机对照试验。未来需进一步研究,以优化现今髁突定位技术,提升其临床实际效用及开拓新型定位技术。